CALL FOR PAPERS

PROCEEDINGS OF  ISDEIV 2008

Abstract submission:	Authors are invited to submit a 250-word abstract via e-mail at office.isdeiv2008@icpe.ro , by December 14, 2007. Acceptance will be communicated by January 15, 2008. The abstract submission has been closed.
Full paper submission:	The submission of the camera-ready manuscripts is June 30, 2008. Extended deadline: July 10, 2008 The full paper submission has been closed.
	Accepted papers will be published in the Symposium Proceedings and will be available to the participants at the beginning of Symposium.

IEEE TRANSACTIONS

Authors who are interested in having a manuscript published in one of the Special Issues of IEEE Transactions (IEEE Transactions on Plasma Science or IEEE Transactions on Dielectrics and Electrical Insulation), are required to submit a full manuscript via IEEE's web portal after the Symposium.

The URL for IEEE Transactions on Plasma Science is http://tps-ieee.manuscriptcentral.com/ .

There will be no pre-selection process.  The full journal manuscript must not be identical to the proceedings manuscript and must be prepared following the style requirements of IEEE Transactions).   In the interested of representing the full spectrum of activities in the field, it is permissible that submission to the Special Issues include contributions that were not presented at the symposium provided those contributions fit well to the topics of the Call for Papers.   The electronically submitted full journal manuscripts will go through a rigorous review process following standard requirements of IEEE Transactions.